NETDA promotes investment in integrated circuit packaging, testing

Nantong Economic and Technological Development Area held an investment promotion for the integrated circuit packaging and testing industry at the first Chemical-mechanical Polishing (CMP) and Advanced Packaging Materials Forum on July 29.

A view of NETDA. [Photo/WeChat account: gh_78ba52d6e1ed]

The forum, organized by Asiachem Consulting, brought together over 80 enterprises and more than 100 industry representatives.

The event also features a closed-door symposium with 10 supply-chain companies. Several of them said they planned to expand into East China and were keen to form long-term partnerships with firms in the development zone.

NETDA has achieved significant progress in its integrated circuit packaging and testing industry. It has attracted companies such as Tongfu Microelectronics and Resonac (China) Investment and has built a supply chain covering semiconductor materials, equipment, design, packaging and testing. It focuses on CMP materials and advanced packaging substrates.