Semiconductor optoelectronic plant breaks ground in Tongzhou
A planned 5-billion-yuan ($762.5 million) semiconductor optoelectronics chip plant broke ground on March 29 in Nantong National High-tech Industrial Development Zone – in Nantong city's Tongzhou district in East China's Jiangsu province – marking a major step forward for the development there of a new-generation information technology sector.
To be owned and operated by Nantong Xinjiayuan Industrial Development Co Ltd, the new plant is on a 14.3-hectare site and when completed will be home to multi-level production and support buildings with a total floorage of 260,000 square meters.
Plans are for construction to be completed in the second half year of 2022, after which the plant will have equipment installed and have final modifications in the first half of 2023, before starting trial operations in September that year.
After ramping up to design capacity, the plant will produce 2 billion semiconductor laser chips and 4 million sets of semiconductor laser modules each year, generating annual taxable sales of 6 billion yuan.
In recent years, Tongzhou district has made great efforts to develop a new-generation information technology industry based on its existing industrial foundations.
To date, it has attracted nearly 50 upstream and downstream enterprises – including Shennan Circuits, SYtech and Unitech Electronics – and established a complete printed circuit board, or PCB, industrial production and supply chain covering multiple categories. These include chip design and testing, circuit board manufacturing and semiconductor materials.
