CCEDZ entrepreneur wins Golden Bull Award
The ceremony of the 26th Golden Bull Award for Listed Companies, hosted by China Securities Journal and Nantong municipal people's government, was held in Nantong, Jiangsu province, on Oct 24.
Shi Lei, chairman of Tongfu Microelectronics, the second-largest integrated circuit packaging and testing company in China based in Nantong's Chongchuan Economic Development Zone (CCEDZ), was honored with the Golden Bull Entrepreneur Achievement Award.
In his keynote speech, Shi discussed the semiconductor industry trends, Tongfu's practice of developing new quality productive forces tailored to local conditions, as well as strategies for using capital to boost development and drive the growth of the integrated circuit innovation chain in Nantong.
Shi has persisted in the path of high-quality development focusing on "intelligent, industrial and efficiency upgrading", aiming to become a technological leader in testing.
On Nov 3, 2021, the 2020 National Science and Technology Award Conference was held at the Great Hall of the People in Beijing. Tongfu Microelectronics, as the main unit, along with Shi Lei received the first prize in the National Science and Technology Progress for the project "key technologies and complete processes for high-density and high-reliability electronic packaging".
This project solved the bottleneck problem in high-end processor packaging technology, occupied the industry's technological high ground, transformed high-density and high-reliability electronic packaging from large-scale to super-large-scale products, and gained international competitiveness.
The ceremony of the 26th Golden Bull Award for Listed Companies is held in Nantong on Oct 24. [Photo/WeChat account: chongchuanonline]
