A high-end chip advanced packaging project with a total investment of 500 million yuan ($73.93 million) was established in Haimen district, Nantong, on June 6, following the signing of a cooperation agreement between the Haimen Economic and Technological Development Zone and Inbest Semiconductor Technology. 

Established in 2011, Inbest specializes in semiconductor packaging and testing services. It is recognized as a national high-tech enterprise, holding over 40 patents and more than 20 software copyrights. The company has achieved significant breakthroughs in the dicing and grinding processes for silicon carbide and gallium nitride products. 

The project focuses on semiconductor wafer thinning, dicing, cutting, and new packaging and testing services. The products are intended for use in sectors such as AI, computing, communication electronics, and wireless infrastructure. 

Construction is slated to begin in the fourth quarter. Once fully operational, the project is expected to achieve an annual production capacity of 50 billion high-end chips with advanced packaging.