Rugao company Wintime showcases its ultra-thin wafer dicing blade at the 6th "China Chuangyi" Entrepreneurship Competition. [Photo/Rugao Sci-Tech Innovation Investment Group]

At the 6th "China Chuangyi" Entrepreneurship Competition, Nantong Wintime Semiconductor Technology, a Rugao-based enterprise, made a historic breakthrough by winning the Excellence Award in the advanced manufacturing category with its ultra-thin wafer dicing blade.

Wintime is a high-tech company specializing in wafer-grade precision cutting blades. It provides comprehensive precision cutting solutions to top clients domestically and internationally. The company received an initial investment of nearly 100 million yuan ($14.04 million), has an annual production capacity of over 1 million blades, and holds 12 patents.

Its independently developed ultra-thin wafer dicing blade achieves a thickness of less than 10 microns, putting it at global standards.

The project was the only one in the advanced manufacturing sector in Jiangsu province to reach the finals, securing 1.3 billion yuan in intended investment from six venture capital firms, the highest amount at the event.