Located in the Nantong National High-tech Industrial Development Zone, Qiangxin Technology (Nantong) Co Ltd has been strengthening its innovation capabilities and achieving impressive results.

As a leading domestic producer of diamond wire substrates, the company made headlines on May 12 by launching an ultra-thin 60-micron silicon wafer in collaboration with Qingdao Gaoce Technology Co Ltd.

"This is the thinnest silicon wafer cut in the world, and it's flexible enough to bend like paper," said Ma Jinfeng, the company's deputy general manager.

Producing diamond wire thinner than a human hair, while maintaining its hardness, requires exceptionally strong alloy wire rods and advanced drawing techniques. To overcome these challenges, Qiangxin Technology has been working with China's Central Iron and Steel Research Institute and other organizations since December 2023 to develop ultra-high-strength alloy wire rods. The company is also collaborating with relevant departments to set industry standards.

In addition to enhancing raw materials, Qiangxin Technology continues to innovate in its production processes. The company now has the capacity to mass-produce steel wires thinner than 32 microns with a strength of 5200 MPa. This achievement places the company at the forefront of the industry in China.

A factory belonging to Qiangxin Technology. [Photo/Nantong Daily]