The signing ceremony for two new semiconductor projects was held in the Shibei High-tech Zone, Nantong, East China's Jiangsu province on Sept 8.

The two projects, both located in the zone, are expected to provide a significant boost to the regional semiconductor industry cluster.

One of the projects involves a total investment of 650 million yuan ($89.24 million) and focuses on the manufacturing of semiconductor wafer carriers. It will engage in the research and development, production, and sales of wafer carriers, integrated circuit trays, and IC tapes. The project is expected to generate approximately 900 million yuan in annual taxable sales.

The other project is Feedli Tech's semiconductor testing equipment manufacturing, with a total investment of 200 million yuan. It will specialize in the R&D, production, and sales of products such as silicon carbide wafer aging and testing equipment. The project aims to achieve annual taxable sales of at least 400 million yuan.

In recent years, the zone has been focusing on nurturing industrial leaders and attracting a group of high-growth industry-leading enterprises. It is striving to attract at least 100 new IC design companies and 10 new manufacturing companies during the 14th Five-Year Plan (2021-25) period.

A signing ceremony for two IC projects is held in the Shibei High-tech Zone. [Photo/Nantong Daily]