Tongfu Microelectronics advances in sci-tech innovation
Tongfu Microelectronics Co Ltd, located in the Chongchuan Economic Development Zone, specializes in integrated circuits packaging and testing. [Photo/ntfabu.com]
Major progress in sci-tech innovation is understood to have taken place at Tongfu Microelectronics Co Ltd, a domestic leader of integrated circuits packaging and testing.
The company is headquartered in the Chongchuan Economic Development Zone, in Chongchuan district – the main urban area of Nantong city in East China's Jiangsu province.
Advanced Micro Devices, Inc. (AMD) is an American multinational semiconductor company based in California, the United States, that develops computer processors and related technologies for business and consumer markets. As a partner of AMD in terms of chip packaging and testing, the company, also known as TFME, is said to have achieved breakthroughs in processing 5-nanometer chips. It is believed this will help its central processing unit clients climb to a higher level.
Established in 1997 and going public on the Shenzhen Stock Exchange in 2007, the enterprise has six production plants in Nantong and Suzhou in Jiangsu province, Hefei in East China's Anhui province, Xiamen in East China's Fujian province and in Penang in Malaysia.
With total assets valued at nearly 30 billion yuan ($4.5 billion) and more than 18,000 employees, it has grown into a multinational which ranks fifth in the world and second in China in the chip packaging and testing sector.
With years of technological accumulation and continuous investment in research and development, TFME has become capable of packaging and testing chipsets on a large scale.
