Major chip packaging, testing project signed in NETDA

The Nantong Economic and Technological Development Area (NETDA) recently signed a contract with Hong Kong Liangding International Ltd for an important project in the chip packaging and testing industry.

This project, with a total investment of up to $100 million and a registered capital of $35 million, is a major collaboration between NETDA and the Nantong Central Innovative Zone.

The goal of the project is to establish an advanced chip packaging and testing industrial base, covering services for chip packaging and testing, research and manufacturing of high-end testing equipment, integrated circuit assembly, and the construction and operation of supporting service platforms. This will create a complete industrial chain integrating research, production, and services.

The project will introduce internationally leading packaging and testing technologies and equipment, with equipment investment exceeding 200 million yuan ($28.10 million). The project is expected to generate an annual output value of up to 1 billion yuan, contributing over 40 million yuan in annual tax revenue.

As the project progresses smoothly and begins operations, NETDA will gradually develop a thriving ecosystem centered on semiconductor packaging and testing, promoting the coordinated development of upstream and downstream industries.

A signing ceremony for the project is held on Aug 16. [Photo/netda.gov.cn]