Tongfu Microelectronics is a leading company in the integrated circuits packaging and testing sector. [Photo/Nantong Daily]

Tongfu Microelectronics Co Ltd, which is headquartered in the Chongchuan district – the main urban area of Nantong city in East China's Jiangsu province – is currently expanding in leaps and bounds.

That's in the wake of the great progress it has made in the construction of integrated circuits advanced packaging and testing, following the start of output at its first production line at Tongfu Tongke (Nantong) Microelectronics Co Ltd.

As a leader in the global and domestic IC sectors, Tongfu Microelectronics generated 15.8 billion yuan ($2.34 billion) in business revenue in 2021, a year-on-year increase of 46.84 percent.

Tongfu Microelectronics Co Ltd is a global leader in the integrated circuits industry. [Photo/Nantong Daily]

Last year, it established a subsidiary – Tongfu Tongke (Nantong) Microelectronics Co Ltd – in the City North Hi-Tech Zone and built an IC advanced packaging and testing base there, which became the seventh production base in the group's business expansion.

On Jan 28, Tongfu Tongke was unveiled and the first set of equipment was installed at the same time. From its business registration, to the project signing and onto the start of production, it took only two months and eight days for Tongfu Tongke's No 2 plant to complete equipment installation and debugging.

It's expected that the new facility will boost the group's overall expansion into advanced IC packaging and testing.